Welcome to the NSN RFQ page on Cosmos Purchasing; from here, you may request a competitive sourcing solution for any parts of interest. As a dependable NSN part in our inventory of Microcircuitassembly items, this component with part number 205-0059-001 and NSN 5962013566553 is available for purchase at any time. This product is manufactured by Dpac Technologies Corp, a trusted entity on our Approved Vendor List (AVL) who upholds a strict level of quality assurance in their practices. They are also a part of a larger supply network that reaches across the globe to enable expedited shipping for our customers wherever they are located.
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Having been given the CAGE Code 66847, Dpac Technologies Corp follows the strict guidelines for part standardization established by the US Department of Defense. If you would like to explore similar products, we invite you to return to our page of 5962 Microcircuits Electronic products or look at the list of related items below. Start the purchasing process on part number 205-0059-001 and any other items of interest today to learn all that Cosmos Purchasing can do as your sourcing partner!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-356-6553 Item PartTypeName: MICROCIRCUIT ASSEMBLY | 5962 | 013566553 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| DPS 1X16-RB | 5 | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| TTQY | TERMINAL TYPE AND QUANTITY | 31 PIN |
| ADAU | BODY HEIGHT | 0.170 INCHES NOMINAL |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION |
| ADAQ | BODY LENGTH | 0.999 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.999 INCHES NOMINAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 4 MEMORY |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
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